of air cooled VPX plug-in units Improve the cooling of VITA 48. 0 and VITA 65 connector interoperability. Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. 5” front panel with Hercules ® high-speed, ruggedized, circular mil connectors allows customization to exact application requirements. Combine various standard components to create a Wedge Lok that satisfies your requirements. See specifications for target performance. The heat from the internal conduction-cooled modules is. It supports up to 16GB of on-board DDR3 ECC memory and supports mSATA SSD. Configure your PCB Wedge Lok. As part of our AoC, air over conduction cooled ATR line, the 810 is designed to maintain safe operating temperatures for high power 3U VPX and SOSA. The logic-optimized FPGA is well-suited. Designed to meet the requirements of VITA 62 for use in harsh environments. As module power continues to increase, however, VITA 48. 0 in. Extended temperature options. VPX7650. The XPand1203 is a low-cost, flexible, development platform. 3U CompactPCI Development Platform for Up to Eight Conduction-Cooled Modules. Single-slot 6U VPX form factor Dimensions: 233 mm x 160 mm x 25. Fast backplane replacement makes for easy reconfiguration in support of every stage of development. 2 Conduction. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A Technology: VPXVPX336 / VPX340 are State-of-the-art, rugged VITA62 compliant 3U/0. The AcroExpress ® VPX6600 is a high-performance 3U OpenVPX TM embedded single board computer based on the 6th Generation Skylake Intel ® Xeon ® E processor and PCH. It is available in air. The DK3 is part of the LCR family of benchtop development solutions supporting VPX system development and the hardware convergence and interoperability initiatives of the US Department of Defense. The Chassis Manager is VITA 46. Study, diagrams and routing of the VPX and cPCI dual bus integrating high-speed links between. Designed for COTS applications this Intel SBC utilizes the Intel C230 series PCH chipset for extensive I/O support. Of the two VPX mechanical form factors, 3U is very popular in certain applications, and 6U is sometimes necessary to build highly parallel systems with optimal computing density. Two-Slot 3U VPX Development Platform for Conduction-Cooled Modules with RTM I/O. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your. VPX™ interface- OpenVPX™ VITA 65 MOD3-PAY-2F2T-16. 1 compliant cPCI, 2 through 8 slots, 32 bit or 64 bit configurations, +5VIO or +3. The XPand1303 is a low-cost, flexible, development platform. Go-No-Go indicators for 12V, 3. Up to 32GB of high-speed. Signal rate: 3. air cooled, conduction cooled, liquid cooled and spray cooled boards. AFT relies on a heat frame that clamshells onto the entire board’s electronics. Conduction cooled card guide for Dawn DC- (n) Series air cooled development chassis. Login. This fully-defined, backplane-centric VPX module optionally supports either commercial GNSS receivers (i. XIt1086. Convection Cooled: SMA Jack (+3. 6U Board with aluminum heatsink. XMC Adapter for 3U OpenVPX This electronics assembly can be damaged by ESD. The XPort3305 is a conduction-cooled dual 10 Gigabit Ethernet XMC with front and rear panel I/O support. 11 monitoring and control Input voltage reverse‑polarity protection Remote voltage sensing for +12V and +3. 3U and 6U VPX mass storage module using the latest NVMe and SATA SSDs. The top-loaded enclosure accepts 6U double-Eurocard-format conduction-cooled modules constructed to meet the IEEE1101. 6U VPX air cooled as per VITA 62, front Panel with Extractor handle, 160 mm deep. (H) Four 0. Sub-½ ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules. Conduction cold plates with enhanced material conductivity such as Thermacore’s k-core APG and heat pipe cold plates in the VPX format can be used to design electronic systems with power levels above that possible with pure aluminum cold plates, but can still rely on conduction. 0 in. 2 mechanicalformat. Zynq Ultrascale+. The XPedite2470 is a high-performance, reconfigurable, conduction- or air-cooled, 3U VPX, FPGA processing module based on the Xilinx Virtex-7 family of FPGAs. 3 slot apertures for a variety of RF and optical I/O connectors targeting a range of applications. 8 in. DECISIVE PERFORMANCE. Rugged Conduction Cooled Assemblies and Modules. or 1. The . FPGA Family. 8" conduction cooled VPX power supplies, built to satisfy the most challenging application requirements while providing up. This Model Can be used to design the VITA Card Chassis. A brief low intensity electric current is applied to individual nerves, with recording. 1. Compare Products. Form Factor: 3U VPX. X-ES provides a comprehensive line of 3U CompactPCI (cPCI) and 6U cPCI products, including Intel® cPCI, PowerPC cPCI, and QorIQ cPCI Single Board Computers (SBCs), carriers, I/O cards, development platforms, and deployable systems for embedded computing applications. 2 Type 2, Secondary Side Retainer. Axis Tool Suite, Health Toolkit, Hardware. manufactures and sells Power Supplies for various COTS architecture systems to include custom and standard designs. The LoC3U-510 is intended for high performance VPX systems where aggregate payload power exceeds 600W. MIL-STD-704F compliant except 50mSec holdup provided by separate module. 0 in. 3U Open VPX power supply Conduction cooled I 2 C IPMI 46. Chassis Example: WILD40 Forced-Air, Conduction-Cooled 3U OpenVPX Chassis has an operating temperature of –40˚C to +70˚C. Removable drive modules rated for 100,000 mating cycles. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. The conduction-cooled module version of VPX-REDI (Figure 3) can be on either a . AoC3U-610 Conduction Cooling with Air Assist. It features a FMC+ slot. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling or to an attached cold plate by conduction. 3U VPX (OpenVPX Compliant) Environmental Specifications Temperature Limits. The XPedite8101 is an Intel® Atom™ E3800-based XMC/PMC available in conduction- and air-cooled configurations. 3U Conduction cooled models available in 1″ form factor. VITA 62 3U 400W AC/DC VPX power supply; Universal AC Input: Single Phase, 85-264VAC, 47-400Hz;Air-cooled, conduction-cooled, REDI versions; 3U single PMC/XMC slot; PCIe x8 Gen 2 interface; These 3U mezzanine carrier cards provide a simple and cost-effective solution for interfacing a PMC or XMC module to a VPX computer system. Intel® Xeon® D-1500 Processor-Based Rugged Small Form Factor (SFF) COTS System with Xilinx Kintex® Ultrascale™ FPGA. The panels on both the front and rear slots are removable for ease of probing and debugging. The PX3030 is a conduction-cooled single-board computer offering an industry-leading combination of processing power and functionality in a 3U VPX-REDI module. 0, 2. Available for use in either AC or DC systems, they are 6U high by 5HP (1-inch) wide modules with guide blocks, for use in VPX systems. August 2021 – Norristown, PA – LCR Embedded Systems has released two new conduction cooled chassis for high speed VPX systems. nVent SCHROFF offers you a wide range of Card Lok, Conduction Cooling and VPX Chassis. With Calmark Card Loks and Birtcher Wedge Loks. Works With: Subracks; Cases. Embedded RuSH TM technology. (L) x 4. VPX 3U. pitch conduction-cooled VPX (VITA 48. Load sharing circuitry for up to 4 modules. AoC3U-1400 Conduction Cooled Chassis with Air Assist VPX VITA 48. or electronic warfare capabilities, which means that AFT-cooled plug-in VPX modules – including both 3U and 6U form factors – retains the current VITA 46. The VPX Timing Clock offers a complete solution set for all PNT needs. The XPedite6101 supports multiple processor configurations, a number of I/O options, and up. The specification of 6U VPX calls for computer cooling via a conduction-cooled envelope compliant with the IEEE standard IEEE-1101. Capacities currently up to 20 TB. 0 in. These 3U VPX boards are delivered with full artifact packages to reduce the risk, cost, and development time required to reach certification. Conduction Cooled Enclosure : Model CC E-3VX4 Another Performance Design from the Team at Dawn Conduction Cooled Enclosure. 2-2020: Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VPX; This Standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two. Available in standard air-cooled and conduction-cooled rugged form factors;The ADC-VPX3-7Z1 is an Open VPX compliant XMC carrier designed to host the Alpha Data ADM-XRC-7Z1 Zynq based mezzanine card. Pictured above (from top counter-clockwise) : Acromag VPX4810 PMC/XMC carrier card in air-cooled, conduction-cooled, and VPX-REDI formats. or 1. Alignment keying headers provided for extender and plug-in card. The standard configuration includes two 10/100/1000BASE-T Ethernet ports, seven. 1” Pitch (Conduction Cooled) 0. The removable storage canisters can be optimized for client operations. or electronic warfare capabilities, which means that AFT-cooled plug-in VPX modules – including both 3U and 6U form factors – retains the current VITA 46. Input Voltages: 15-40 VDC. 3U VPX Form Factor, 1” Pitch (conduction cooled) 4, or 8 Lane (factory configured) PCI Express 3. VPX Test Extender 3U 240mm for conduction cooled boards in conduction cooled chassis. Innovative Integration recommends that all electronic assemblies and components circuits be handled with appropriate precautions. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards. Learn more about this product below » Acromag’s XMC-7A200CC modules feature a high-performance user-configurable Xilinx® Artix®-7 FPGA enhanced with high-speed memory and a high-throughput serial bus interface. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5 V, and up to 80 A on 3. 2 Advanced Thermal Solutions High speed VPX systems demand advanced solutions to manage hot, power hungry board payloads. 4 PTC resistors (TMP300 IC); one each at the front at bottom and top as well as rear top and bottom, analog output 10mV/°C (typical 750mV ±30mV at 25°C), Optional DVM plug-on board, Voltage and temperature sense lines are connected to 2 x 8 pin header (X1 connector) on front panel, Voltage levels for. • Rugged VPX systems where thermal performance is a concern • Options for second level maintenance APPLICATIONS • Meets VITA 48. VPX is a broadly defined technology utilizing the latest in a variety of switch fabric technologies in 3U and 6U format blades. Most VPX systems make use of VITA 48. The result is a powerful and flexible I/O processor module that is capable of executing custom instruction sets and algorithms. 5” front panel with Hercules ® high-speed, ruggedized, circular mil connectors allows customization to exact application requirements. WILDSTAR 3XV7 3U OpenVPX FPGA Processor – WB3XV7. 35mm X 160mm] for circuit Boards & plug-in units with AIR or Conduction cool mechanism The base Mechanical specifications of PCB & Plug-In units are defined by VITA46 The Allowable Standoff Height for PMC/XMC is 10mm where 0. The 7SL-3500 VPX System is a modular Military Rugged ATR enclosure, geared for 3U OpenVPX designs. OpenVPX is the architecture framework that defines system level VPX interoperability for multi-vendor, multi-module, integrated system environments. 3 Slot to 5 Slot each. 11. (0°C to +55°C) and conduction-cooled version (-40°C to + 85°C). PXI Express Chassis Systems. The Rise of VPX Cooling Requirements VPX systems are typically built with an air or conduction cooled chassis which holds the VPX backplane and provides the mechanical support for the VPX plug-in modules. The DK3 / DK6 for 3U and 6U VPX system design, support air and conduction cooled modules with quick conversion that tracks and streamlines your development cycle. 2) modules. Data Plane. VPX Extender 3U All Differential - Conduction / Conduction. Load board for VPX systems, meets ANSI/VITA mechanical and electrical connection standards Convection and conduction-cooled versions available Verifies chassis can meet power requirement and specifica-tions for VPX Aids in locating hot spots in the chassis Go-No-Go indicators for 12V, 3. 3U VPX boards, and utilizes RTMs to simplify I/O access and support rapid system prototyping. Shock: 40G peak for conduction-cooled; Dimensions: 160mm x 100mm x 25. Ideal for SBCs or carriers for VPX, VME and cPCI (Compact PCI/PCIe or PXI) - Commercial or Rugged/Conduction Cooled Systems. With two PCI Express Fat Pipe P1 interconnects and two Gigabit Ethernet ports, the XPedite7477 is ideal for the high-bandwidth and processing-intensive demands of today's. Extreme Engineering Solutions (X-ES) is the first to ship OpenVPX™ compliant 3U development systems: XPand1200, a development platform for conduction-cooled modules, and XPand1300, a development platform for air-cooled modules. or 1. The liquid-cooled chassis sidewalls will. VMEbus International Trade Association, 2010. 0 in. 84 W Weight Conduction cooled: 535. The VPX340 and VPX336 series are commercial off-the-shelf (COTS) conduction-cooled, ruggedized, small-form-factor power supplies according to the VITA 62. Conduction-Cooled 3U VPX-REDI XMC Carrier Card. A x8 PCI Express 2. PWB area and improved thermal management (air-cooled, conduc-tion-cooled, liquid flow-through cooling), enabling increased func-tional density and providing support for use as an LRM. Abaco Announces Production of. View. The development systems use Concurrent Technologies' commercial off the shelf boards which are also available as rugged conduction cooled, VPX-REDI boards ensuring that applications which are produced on the development Systems can be easily progressed to a ruggedized implementation. Embedded RuSH technology actively monitors voltage, current and temperature and talks over system management bus using I2C. With a total of six high-performance Gigabit Ethernet interfaces (2 routed, 4 switched), the 3U conduction-cooled (VITA 48. 0 in. nanoGrabber-HD-RGB HD RGB Video Frame Grabber for miniPCI-Express. 2 Type 2, Secondary Side Retainer. NXP QorIQ T2080 Processor-Based Conduction- or Air-Cooled 3U VPX SBC. Products. Technical Specs Accessories Documentation Block Diagram The XPand1200 is a low-cost, flexible development platform, supporting up to eight 0. CCG-6860 Conduction Cooled Card Guide. Graphics Processing Units (GPUs) LCR Embedded Systems’ fully integrated, conduction-cooled, featherweight 2-Slot VPX System (shown at right) will break new ground in addressing the concerns of UAV application developers and allow for the massive expansion of payload performance and processing power for autonomous vehicles. 91 KB. The AcroExpress ® VPX6600 is a high-performance 3U OpenVPX TM embedded single board computer based on the 6th Generation Skylake Intel ® Xeon ® E processor and PCH. One high-speed link on VPX-P1(control plane) Up to twelve high-speed linkson VPX-P1. NXP (formerly Freescale) QorIQ T2080 Processor-Based Conduction- or Air-Cooled 3U VPX Single Board Computer (SBC) The XPedite5970 provides a rugged, feature-rich processing solution that maximizes the performance-per-watt capabilities of a Power Architecture®-based processor module. N/A. See the Rugged section for more details. The 53xxx Series mounts one XMC module on a 3U VPX carrier with a flexible crossbar switch. The SBC627 rugged 6U VPX single board computer offers more processing power, more bandwidth, and more graphics capability – with no increase in the size, weight or power requirements of previous generations – enabling fewer system slots to be used. It also supports IPv6 and a comprehensive set of IETF RFCs and IEEE protocols. 10 Rear transition module on VPX VITA 46. 1. Pixus also provides conduction-cooled and customized OpenVPX enclosure solutions. 8, air flow-through cooling without sealing for small form factor 3U and 6U VPX modules (ANSI ratified October 2017) The environment in which the boards will be. 0 port is routed per VITA 42. 100 Ohm differential pair routing. 0 in. Secondary Side Wedge lock conduction cooled. Form Factor: 6U VPX Chassis Type: Development Number of Slots: 2 Dimensions: 17. The high-performance VX305C-40G is available in both air-cooled (for lab or other benign deployed environments) and conduction-cooled Plug-in units as per VITA 48. VITA 91 high-density connectors allow for a completely switched backplane. 2-7. The Behlman VPXtra® series of COTS AC to DC and DC to DC power supply are rugged, highly reliable, conduction cooled, switch mode unit built for high-end industrial and mission critical military. Dawn’s VPX backplanes support development systems, deployable rack mount and mission critical systems for convection and conduction cooled modules. 2 mechanical format. 8 are already available, such as this 3U VPX COTS system with air-flow-through cooling. VP32004 is a high-performance PC-based 3U VPX processor board developed by Linkedhope®. For use in DC systems, they are 3 U high by 5 HP (1-inch) wide modules with guide blocks, for use in conduction cooled VPX systems. The D575. 350 W VITA 62 PSU-Conduction Cooled. VITA 62 Compliant 3U VPX power supply. The Extreme Engineering Solutions XPand6200 Series Sub-1/2 ATR, Conduction- or Convection-Cooled Chassis Supporting Conduction-Cooled VPX and XMC or PMC Modules is a true Commercial-Off-The-Shelf (COTS) Rugged system, supporting many 3U VPX, XMC, and PMC modules without modifications to the chassis or backplane to. With a Core 2 Duo processor at up to 2. 8 in. It provides an easy way to integrate switched mezzanine cards into modern VPX backplanes. 3U VPX Graphics. Development chassis for VPX and SOSA aligned module payloads. The SX-150 is available in the VITA 48. Ideal for SBCs or carriers for VPX, VME and cPCI (Compact PCI/PCIe or PXI) - Commercial or Rugged/Conduction Cooled Systems. The heat from the internal conduction-cooled modules is conducted to sidewall heat exchangers, where it is dissipated to the ambient environment by convection cooling or to an attached cold plate by conduction cooling. VPX Carrier Cards Bulletin #8400-626i Air-cooled, conduction-cooled and REDI versions 3U One PMC/XMC slot PCIe x8 Gen 2 interface VPX4810 VPX Carrier Cards for XMC or PMC Modules Conduction-cooled version VPX REDI VITA 48 version P2 PCIe x4 PCIe x8 PCIx 64-bit PMC I/O PMC/XMC Site P1 Port A PCIe x8 PCIe Switch PCIx to PCIe Bridge. I designed this 3U VPX 0. VITA 46. Up to. 9 PMC/XMC/Ethernet Signal Mapping to 3U/6U VPX VITA 46. Depending on your processing requirements, XPand3200 Series systems can be populated with high-performance, low-power 3U VPX or. 25 GHz, the MPC8640D delivers. The XPand1205 is a low-cost, flexible development platform, supporting up to eight 0. This efficient thermal design allows up to 60 W of. An AFT heat frame includes a closed duct, which is embedded with fins. Length: 160 mm. MEMKOR VPX series offers deployment flexibility through a highly rugged military-grade 3U OpenVPX storage module. This. The XChange3031 is a conduction-cooled 3U VPX Ethernet switch module. pitch conduction-cooled VPX (VITA 48. 1-2201-compliant conduction-cooled 3UVPX carrier card . The chassis is cold plate base coupled conduction cooled. The XPort3305 is a conduction-cooled dual 10 Gigabit Ethernet XMC with front and rear panel I/O support. Power and reset LEDs are provided for. Documentation. Both XMC and PrPMC interfaces are active simultaneously. Component selection, thermal design, and electrical design have all been made with the requirements of high-performance embedded computing at the forefront. One Payload and remaining Peripheral Slots (with Switch slot option) High Speed fans with 1U Tray at the bottom. Part of our line of conduction cooled enclosures with air assist, the AoC3U-1400 is designed to maintain safe operating temperatures for high slot. Keying for Conduction Cooled VME64x: This standard is an extension of the VME64x Standard, ANSI/VITA 1. The XPand1508 supports two standard VITA 46. 125 Gb/sec. Expansion Plane. WOLF’s 3U VPX modules use the 1" pitch allowed in VITA 48 (VPX REDI). 1 compliant products to extend the temperature range of operation to drive the costs down To keep the weight low to avoid the use of other less cost effective solutions based for instance on the VITA 48. Input Voltages: 85-264 VAC, 5. Extremely robust, bullet proof design ♦ Fully integrated power supply, backplane, I/O in one box ♦ 4-Slots of 3u VPX on 1” pitch (OpenVPX Ready) ♦ Full environmental sealing per DO-160E ♦ Vita 48. Aisle Containment. Five slots 3U VPX conduction cooled Chassis. 85" or 1. Ports: OpenVPX 3U Switch slot profile: SLT3-SWH-2F24U-14. It’s hybrid cooling design stretches the cooling capabilities in equipment built with readily available VPX, VITA 48. Conduction-Cooled Assemblies (CCA) adaptor (EuropacPRO/-rugged, VPX/CompactPCI) *The price shown is the per piece price and does not include VAT. For use in DC systems, they are 3 U high by 5 HP (1-inch) wide modules with guide blocks, for use in conduction cooled VPX systems. Conduction cooled 3U VPX module; Mechanical. 2) where keying as defined in the VME64 Extensions standard cannot be applied. Learn more about the AcroExpress VPX SBC and see all VPX models. Higher conduction means lower component temperatures . ANSI/VITA 0- 001[R 005] defines the rules for designing Our VPX backplanes are designed to allow any COTS or customer spec by providing a wide range of available VPX and OpenVPX profiles. (H) Four 0. . It can. Also Available: A rugged ATR versionFeatures. VENRAY, the Netherlands July 21st 2010 - VSN Systemen bv, a leading telecom hardware and software developer, launches OpenTSP NG technical building blocks,which are essential for the development of the newest multimedia applications. Development chassis and accessories for VPX and SOSA aligned module payloads to support every stage of product development. or 1. Fault monitoring and control. It features a FMC+ slot. The XPedite5570 supports up to 8 GB of up to DDR3-800 ECC SDRAM, as well as up to 32 GB of NAND flash and up to 512 MB of NOR flash (with redundancy). A comprehensive 3U VPX product portfolio of PICs aligned with CMOSS and SOSA technical standards such as SDR, DSP, SBC, networking, communication, and PNT. VX3060-S2 Rugged Air cooled variant is designed to meet VITA 47 class EAC6 V2 and can operate in extended temperature environ-ments up to of -40 °C/+70 °C. VITA 62 power connector. 03/12/2021. Form Factor. The XPedite7477 is a high-performance, low-power, 3U VPX-REDI, single board computer based on the 3rd generation Intel® Core™ i7 processor and Intel® QM67 chipset. The XPand4200 Series redefines the limits of power, performance, and functionality in a sub-½ ATR chassis. 6"W x 9. Continuous 580W output over temperature range of-40C to +85C. It supports up to two 0. With an auto-ranging 90 to 264VAC input, PFC, and military EMI filtering, the PUMA-2509 gives 300W to 6 fully controlled and regulated outputs. Data Center Solutions. pitch air-cooled VPX (VITA 48. Horizontal air-flow cools over 150W per slot to support state-of-the-art processor boards. The DK3 allows fast backplane replacement and conversion between air and conduction-cooled slot inserts. StoreEngine is designed to work as a standalone single slot storage device with. 3U VPX with NVIDIA Jetson AGX Xavier Industrial and ConnectX-6, SOSA aligned Payload profile module for HPC tasks such as sensor data processing, machine vision, and other C4ISR tasks. View. Available for use in either AC or DC systems, they are 6U high by 5HP (1-inch) wide modules with guide blocks, for use in VPX systems. Specification Ordering Information Related Products Resources Summary The ADC-VPX3-XMC is a single XMC carrier for VPX based systems. PCI-SYSTEMS Inc. or 1. VITA 48. 0, with conduction-cooled and air-cooled versions, provide the assurance of mechanical ruggedization in COTS-based military systems. Hartmann Electronic VPX Standard Chassis are designed to allow any. 4. This standard defines the mechanical requirements that are needed to ensure the mechanical interchangeability of conduction cooled 3U and 6U Plug-In Modules and defines the features required to achieve Two Level Maintenance compatibility. It provides 550 W of total simultaneous power, which can be distributed as up to 50 A on 12 V, up to 50 A on 5. 2 coaxial/RF for four of the slots (defaultbackplane routing) All I/O are thru the front of the chassis; 250W integrated. Ideal for rugged deployed, mobile applications. XMC and AcroPack expansion slots add flexibility for on-board FPGA processing, I/O. View product. Conduction Yes 12 TB 5 GB/s Yes Host Based Yes 7x PCIe Gen3 x4/x8 If used with StoreEngine. Verifies chassis can meet power requirement and specifications for VPX. CCG-6860 Conduction Cooled Card Guide. 2, 2022 Edition, 2022 - Mechanical Standard for Conduction Cooling VPX. (604) 875-4405. 1, titled “VPX Conduction Cooling: Frame Construction,” extends the VITA 48. Search for: Products. We offer air & conduction cooled power supply units for wide range AC as well as DC input. 15g. 1-1997. Cisco ESR6300 with two routed, four switched Gigabit Ethernet interfaces. Air cooled: 3U VPX 0. The XPand1015 system is a low-cost development platform for conduction-cooled 6U VPX cards. 3 slots – ROHS and CE compliant articLe part. High Performance Embedded Computing. The VTX985 is a dual slot 3U VPX chassis conduction cooled for two 3U VPX modules. Selected Filters. It helps test a system's coolingcapabilities. 3VIO, Short tail connectors on J1, long tail connectors on J2. pitch without solder-side cover (optional) 1. Typical Capability: 200 W per 6U slot. They are low-power system-on-chip (SoC. Designed to meet the requirements of VITA 62 for use in harsh environments. ANSI/VITA 48. Quick. 2, “Mechanical Specification for Microcomputers Using REDI Conduction Cooling Applied to VITA VPX”, developed by VITA, defines the mechanical requirements that are needed to ensure the mechanical interchangeability of air-cooled 3U and 6U plug-in units and define the features required to achieve two level maintenance compatibility. The Ethernet fabrics allow VPX cards within the system to communicate and also have access to an outside local area network. 10 RTM slots for accessing I/O from the corresponding 3U VPX modules installed in the XPand6200 Series. 0 specification for use in Mil/Aero VPX systems. Related Products. The modules can be easily tailored to suit individual requirements,VPX Test Adapter. High bandwidth multiGig RT connector for VPX boards; Air- cooled and conduction-cooled versions; Overview. ½ ATR-compliant, natural convection-cooled or conduction-cooled chassis (reduced height and length) Dimensions: 10. Theconduction-cooled VPX load board helps confirm the chassis meets the VITA46/48/65 power specifications for VPX and aids in locating hot spots within theenclosure. This allows testing of the conduction cooled modules without going through the thermal chamber. These PSUs are available in 3U or 6U form factor. The first100GbE 3U VPX SBC on the market aligned to SOSA 1; Up to 256 GB M. 11 12 V 3. wedgelocks are utilized to secure conduction-cooled pcb modules in deployed system level, embedded electronics enclosures. PCIe. 2 * DDR4 banks (up to 4GB each) The IC-FEP-VPX3d is a 3U VPX FPGA processing board based on a Kintex® UltraScale™ FPGA (KU060, KU085 or KU115). 3U VPX-REDI conduction- or air-cooled form factor; Dimensions: 100 mm x 160 mm; 0. 2 extraction levers and performance wedge locks • 3X - Samtec HQDP connectors for 1G. Eight 6U VITA 48. 8-2017, “Mechanical Standard for Electronic VPX Plug-in Modules Using Air Flow Through Cooling” was developed and promoted by a working group sponsored by Lockheed Martin,. Accessories. The XPand1007 can be configured as two I/O isolated slots, with all I/O from the payload passed to the RTM. Our expertise also includes VITA 66, VITA. 7W. The XPand1004 system is a low-cost development platform for conduction-cooled 3U VPX cards. FEATURES. 3U VPX boards and utilizes RTMs to simplify I/O access and support rapid system prototyping. 2 conduction cooled modules because of their established deployment track record. or 1. View product. It provides 550 W of total simultaneous power, which can be distributed as up to 8 A on 12 V, up to 80 A on 5. Product Features. VPX hold up power supply is a type of power supply used in high-performance computing applications. ruggedization solutions for vpx & cpci. Created Date: 3/20/2017 10:06:58 AM. Rugged 3U VPX graphics & GPGPU card based on the NVIDIA Turing architecture using the NVIDIA Quadro RTX 5000 GPU with single-link DVI and DisplayPort™++ outputs. 0 in. Sarsen Technology supports a range of high performance computer graphics hardware based on NVIDIA and AMD technology for applications including GPGPU computing, video capture and processing, Artificial Intelligence (AI), and data archiving. Signal rate: 3. The Intel® Atom™ E3800 processors provide excellent computational performance and I/O functionality for their power profile and size. This enables the VX305H-40G to sustain 70°C card edge temperature according to VITA 47 XMC support. 1 ATR platform with liquid cooled side walls, 6U conduction cooled boards, 1” pitch, per VITA 48. 8 in. Sub-½ ATR, Conduction-Cooled Chassis for Conduction-Cooled Modules. or 1. 2 conduction cooled modules because of their established deployment track record. View. All offers are typically available for. Our Card and Software Packages are Designed for Fast, Portable Integrations.